Call for Abstracts and Exhibitors Opens for HI-AM 2026
October 2, 2025Waterloo, ON– The 9th Conference on Holistic Innovation in Additive Manufacturing (HI-AM 2026) will take place on June 23–24, 2026, in Banff, Alberta, Canada. It will be the first time the conference is hosted in Alberta, with the Canadian Rockies providing a distinctive setting for knowledge exchange and networking in the additive manufacturing (AM) community.
Researchers, engineers, and professionals from across the AM sector are invited to submit abstracts for consideration in the technical program. The deadline for submissions is February 2, 2026.
In addition to the technical program, HI-AM 2026 will feature an exhibition program, offering companies and organizations the opportunity to present their latest products, services, and innovations to a highly engaged AM audience. Applications to exhibit are open until March 2, 2026.
The conference is organized under the HI-AM 2.0 project, primarily supported by the Natural Sciences and Engineering Research Council of Canada (NSERC). Over the years, HI-AM has established itself as a key conference in Canada’s additive manufacturing landscape, bringing together academia, industry, and government to advance research, collaboration, and innovation.
For further details on conference themes, submission guidelines, and exhibition packages, visit hiam.uwaterloo.ca/2026.
About the HI-AM Conference:
The Holistic Innovation in Additive Manufacturing (HI-AM) Conference, established in 2018, brings together leading experts and innovators in additive manufacturing from across Canada and around the world. With a strong emphasis on interdisciplinary collaboration and research, HI-AM serves as a premier platform for discussing the latest developments, breakthroughs, and challenges in this rapidly advancing field.
Contact Information:
Email: hiam@uwaterloo.ca
Website: hiam.uwaterloo.ca/2026
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